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Heat conduction plate heat transfer products

Heat conduction plate heat transfer products

Heat conduction plate heat transfer products
Heat conduction plate heat transfer products
Product Introduction
  • Efficient heat conduction plate for rapid transfer
  • High thermal conductivity materials ensure performance
  • Uniform heat distribution across contact surfaces
  • Compact design for space-constrained applications
  • Customizable solutions for diverse thermal needs
  • Reliable passive heat transfer without power
  • Easy integration into electronic and industrial systems

Products Details

When the heat source area is relatively large and a single heat pipe cannot effectively cover the heating surface, using multiple heat pipes becomes less economical than using a multi-channel array aluminum vapor chamber.

A multi-channel array aluminum vapor chamber is structurally composed of multiple independent channels arranged side by side along the width direction.

This structure offers several advantages:

1. High reliability. The surface is divided into multiple independent sections, so damage to one section or channel does not affect the normal operation of others. Even if damaged (such as punctured), the thermal conductivity decreases but the product does not fail.

2. Excellent pressure resistance. The internal partition structure acts as a support under external force. Standard designs can withstand internal or external pressures exceeding 10 MPa, and reinforced structures can handle even higher pressures.

3. Mature and efficient manufacturing process. The product uses extruded aluminum as the raw material, with a mature, stable, and reliable process and high production efficiency.

4. Short inactive length. Our unique welding process reduces the inactive end length to as little as 1–3 mm, significantly shorter than the 5–9 mm of copper heat pipes. This provides clear advantages in compact spaces. Additionally, the welded ends are rounded, improving sealing reliability and avoiding sharp edges that could cause injury or damage.

5. Large heat transfer area and easy full coverage of heat sources. With widths ranging from 10 to 300 mm, the product can fully cover heating or cooling surfaces without requiring additional copper or aluminum spreader plates, enabling more direct heat transfer.

Compared with heat pipes:

1. Heat transfer capacity: Although the heat transfer capability of a single unit at room temperature may be lower than that of a heat pipe of the same size, the overall capacity is higher because the vapor chamber typically has a much greater width than a single heat pipe.

2. Cost: This product uses aluminum, which is less expensive than copper. While costs increase for larger sizes, it provides more complete contact with the heat source and more direct heat transfer. Heat pipes are limited in width and usually require a bonded copper plate as a heat spreader.

3. Operating temperature range: Copper heat pipes are typically suitable for 50–150°C, while multi-channel aluminum vapor chambers, with different working fluids, can operate across a wide range from -60°C to 300°C.

4. Performance at room temperature: Heat pipes have strong heat carrying capacity and are suitable for high-power, small-area heat sources; multi-channel aluminum vapor chambers are better suited for lower power, large-area heat sources.

Applications of multi-channel aluminum vapor chambers:

1. Cooling large-area chips, such as memory chips;

2. Large heat sinks, such as those for IGBT modules and high-power LEDs;

3. Lightweight heat transfer requirements, such as in drones and portable electronic devices;

4. Applications involving frequent high and low temperature cycling, such as testing equipment;

5. Long-distance vertical heat transfer applications, such as outdoor displays and heat exchangers.

Customization options for our multi-channel aluminum vapor chambers:

1. Materials: Commonly 1100 aluminum alloy, with options including 1060 or 3003 aluminum alloys;

2. Width: 10–300 mm;

3. Length: 100–2000 mm;

4. Operating temperature range: Multiple options covering -60°C to 300°C;

5. Surface treatment: Conductive oxidation, anodizing, hard anodizing, painting, etc.;

6. Lead time: 3 days for samples without tooling, 30 days with tooling; mass production delivery time to be negotiated.

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FAQ

1.What is a heat conduction plate?

A heat conduction plate is a device designed to transfer heat efficiently across surfaces in thermal systems.


2.How do heat transfer products work?

Heat transfer products move heat through conduction, spreading thermal energy evenly across components.


3.What are the advantages of heat conduction plate / heat transfer products?

Heat conduction plate / heat transfer products offer efficient heat transfer, compact design, and reliable performance.


4.Where are heat conduction plate / heat transfer products used?

Heat conduction plate / heat transfer products are used in electronics, industrial equipment, and energy systems.


5.Can heat conduction plate / heat transfer products be customized?

Yes, heat conduction plate / heat transfer products can be tailored for materials, size, and thermal requirements.


6.Are heat conduction plate / heat transfer products energy efficient?

Yes, heat conduction plate / heat transfer products provide passive cooling without additional energy consumption.


7.Why choose heat conduction plate / heat transfer products?

Heat conduction plate / heat transfer products ensure stable and efficient thermal management solutions.


8.Do heat conduction plate / heat transfer products require maintenance?

Heat conduction plate / heat transfer products require minimal maintenance due to simple and durable design.


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