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Aluminum Block Liquid Cold Plate

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Aluminum Block Liquid Cold Plate

Aluminum Block Liquid Cold Plate
Aluminum Block Liquid Cold Plate
Product Introduction
  • Efficient heat dissipation for high-performance electronics.
  • Durable aluminum construction ensures longevity.
  • Optimized liquid cooling for maximum thermal management.
  • Lightweight design for easy integration into systems.
  • Supports high power densities with minimal temperature rise.
  • Customizable dimensions and port configurations available.
  • Corrosion-resistant materials for extended use.
  • Ideal for data centers, industrial, and automotive applications.

Products Details

TypeBroaching, Drilling, Etching / Chemical Machining, Laser Machining, Milling, Other Machining Services, Turning, Wire EDM, Rapid Prototyping
Material CapabilitiesAluminum, Brass, Bronze, Copper, Hardened Metals, Precious Metals, Stainless Steel, Steel Alloys, Titanium CNC
CNC Machining or NotCNC Machining
Micro Machining or NotMicro Machining
Product nameHeatsink Machining
Tolerance0.002mm
OEM/ODMAccepptable
ProcessCnc Machining+deburrs
Drawing FormatDWG, STP
LogoCustomer Logo
Surface treatmentAs per Request
PackingPoly Bag + Inner Box + Carton
CertificationISO9001:2018/ROSH
MOQ1PCS
Selling UnitsSingle item
Single package size35X25X25 cm
Single gross weight1.000 kg

Aluminum Block Liquid Cold Plate+

FAQ

1. What is the Aluminum Block Liquid Cold Plate used for?
It is used for efficient heat management in high-performance electronic systems.

2. Is the cold plate customizable?
Yes, dimensions and port configurations can be tailored to your needs.

3. What industries benefit from this product?
It is ideal for data centers, industrial equipment, and automotive applications.

4. How does it improve thermal management?
It uses optimized liquid cooling to reduce heat buildup effectively.

5. Is the material durable?
Yes, the aluminum construction ensures long-lasting performance.

6. Does it resist corrosion?
Yes, it features corrosion-resistant materials for extended use.

7. Can it handle high power densities?
Yes, it supports high power densities with minimal temperature rise.

8. Is it easy to integrate?
Yes, its lightweight design makes system integration simple.


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