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Large Bonded Fin Aluminum Heat Sink

Large Bonded Fin Aluminum Heat Sink

Large Bonded Fin Aluminum Heat Sink
Large Bonded Fin Aluminum Heat Sink
Product Introduction
  • Efficient heat dissipation for high-performance electronics.
  • Lightweight aluminum construction for easy handling.
  • Customizable designs to fit specific applications.
  • Enhanced thermal conductivity with bonded fin technology.
  • Durable and corrosion-resistant material.
  • Cost-effective cooling solution for industrial use.
  • Scalable manufacturing for large volume demands.
  • Compatible with various electronic components.

Products Details

Grade6000 Series
ShapeFlat
TemperT3~T8
Tolerance±1%
ApplicationHeat Sink
Processing ServiceCutting
Delivery Time31 ~ 45 days
Alloy Or NotIs Alloy
Product nameAluminum Extrusion Profile
MaterialAlloy 6063/6061/6005/6060/6463/6082 T5/T6
CertificationISO 9001
Surface treatmentCustom Surface Treatment
Thickness0.30mm--Customized
ProcessExtruding+Machining(if Need)+surface Treatment
ProductsAluminum Extruded Heat Sinks
ServiceOEM ODM Customised
KeywordHeat Sink Extrusion
LengthCustom Length
Selling UnitsSingle item
Single package size100X100X100 cm
Single gross weight3.000 kg

Large Bonded Fin Aluminum Heat Sink+

FAQ

1. What is a Large Bonded Fin Aluminum Heat Sink?
It is a device designed to dissipate heat from electronic components using bonded fin technology.

2. How does bonded fin technology work?
Bonded fin technology increases surface area, enhancing heat dissipation efficiency.

3. Why use aluminum in heat sinks?
Aluminum offers excellent thermal conductivity and is lightweight.

4. Can these heat sinks be customized?
Yes, they can be tailored to meet specific application requirements.

5. What industries benefit from aluminum heat sinks?
Industries like electronics, automotive, and telecommunication benefit from these heat sinks.

6. Are these heat sinks corrosion-resistant?
Yes, they are made from materials that resist corrosion.

7. Do they support high-performance electronics?
Yes, they efficiently cool high-performance electronic systems.

8. Is the heat sink manufacturing scalable?
Yes, manufacturing can be scaled to meet large volume demands.


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